Micro Assembly with motorized Bond Axis
T-5300
Manual Bonder with semi auto. process capabilities
Tresky’s T-5300 is the flagship of our Die Bonders and adds a motorized, programmable Z-axis, with our True Vertical Technology™, to the repertoire of the universal T-5100, making it extra useful for repetitive processes in small-scale production, where operator influence must be minimized. The T-5300 really shines in applications with highest
precision requirements, such as flip-chip, or eutectic placement. An optional high-resolution beam splitter unit allows sub-micron placement accuracy.
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T-5300-W
Manual Bonder with semi auto. process capabilities
Wafer Handling capability
The T-5300-W version offers the same flexibility as the T-5300 with the added benefit of being able to handle wafers with Tresky's electric die ejection system, which is located under the main table. The system has all the basic features to run the most advanced applications in the industry. For this you can add a wide range of available options. Like all Tresky products, the T-5300-W includes True Vertical Technology™, which guarantees parallelism between chip and substrate at any connection height. Along with superior ergonomics, the platform is the industry's most advanced system in its class and is even easier to use with the new intuitive software.
The T-5300-W version features the same flexibility than the T-5100 and has the additional advantage of handling a wafer of up to 200mm which sits below the main table with Tresky’s electrical die ejection system.
Typical and customized applications
• Die sorting from wafer into waffle packs or gel packs
• Die attach with adhesive (stamped or dispensed)
• 3D packaging of MEMS, MOEMS, VCSEL, Photonics, ...
• High-precision placement with visual adjustment by beam-splitter unit for look-up inspection of
edges, corners or patterns, e.g. for laser bars
• Flip-Chip with ultrasonic die attach
• Flip-Chip with adhesives or anisotropic foils
• Sensor assembly
• UV curing of die attach
• Eutectic bonding of AuSi, Copper Pillar and others
• Ultrasonic bonding on a curved surface
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T-5500
Tresky’s T-5500 adds a High Force Machine to the line of the T-5100 and T-5300. The sophisticated design of the integrated HF-module, up to 100Kg, in combination with
the Tresky True Vertical Technology ensures an absolute coplanarity between chip and substrate at any height and force during the bonding process.
The T-5500 is equipped with a motorized, programable Z-axis and new with a motorized Theta-axis (spindle rotation). The T-5500, with its Bonding Force up to 100Kg, really
shines in applications with highest precision requirements in Thermocompression Bonding, such as Sinter-Bonding and Flip-Chip.
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Any questions or interest in a online product demonstration?
Fabio Cocca - your sales contact at Dr. Tresky AG would be happy to talk to you personally. Give him a call or simply use our enquiry form.
+41 44 772 19 41
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