DR. TRESKY AG - Die Bonder / Micro Assembly Solutions
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Stamping and flux station

Suitable for stamping of adhesive or for dipping of picked-up Flip-Chip (or any other component) into Flux before placement.

Both processes use the same motorised adhesive/flux container. The motorised container is maintaining a defined and constant layer of flux or adhesive. For stamping of adhesives application, is the stamping tool, attached to the dispenser arm by means of an adapter.

All Tresky Die Bonder can be equipped with a stamping and flux station.

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Datasheet (PDF)

Tresky stamping option for die bonders