Eutectic Overview
Many bonding processes in microelectronics require the supply of heat. That is why Dr. Tresky AG has developed a wide range of static and dynamic heaters and a powerful software package.
All Tresky Die Bonder can be equipped with the following options:
- TO Heating Unit
- Heating plates for static heating
- Heating plates for temperature profiles with cooling
- Tool heating for temperature profiles with cooling
- Software for graphical programming with real time display
- Inert gas chamber available for all heating plates
- 2nd spindle for pre-form handling
- Scrub or Ultrasonic
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Dynamic TO-Heating Unit
Seeing increased demands on the market Tresky offers now the second generation of the dynamic TO-Heating Unit with excellent qualities.
- For TO sizes up to D30mm / pin lengths 24mm
- Heating ramp up to 40K/s
- Max. temperature 400°C
- Gas chamber and gasflow controller
- TO Indexer optionally available
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