Products

We are pleased to introduce our Die Bonder and Pick and Place systems, which are designed for research and development purposes as well as for small batch production. The modular design and the "open system concept" of the Tresky machines allow both an extension of the application areas with little effort as well as countless customized solutions. In short, with a Tresky, micro-assembly and chip assembly becomes very easy.

Have we drawn your attention? We would be happy to show you the possibilities with an online product demonstration.