DR. TRESKY AG - Die Bonder / Micro Assembly Solutions
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Dr. Tresky AG
Tresky_at_tresky.com

We're thrilled to announce our new T-5500.

The T-5500 is a High Force Die Bonder with a bond force up to 1000N with Tresky’s True Vertical Technology™! This state-of-the-art machine is designed to meet the most demanding requirements of our industry.

With its advanced capabilities, the T-5500 High Force Die Bonder ensures superior performance, efficiency, and reliability. Whether you're working with Sinter, Large Devices or challenging projects, this machine is the perfect solution to elevate your process.