Experience Innovation with Us at PCIM Nuremberg!

April, 23 2024

We're thrilled to be part of PCIM Nuremberg, the premier event for power electronics, intelligent motion, and energy management. Join us as we showcase our latest advancements in die bonding technology.

Drop by our booth to discover how our solutions are shaping the future of semiconductor manufacturing. Our team will be available to discuss your specific requirements and demonstrate how our technology can drive efficiency and performance in your processes.

Don't miss this opportunity to connect with us

Date: 11-13.06.2024

Location: Nuremberg

Learn more: Website PCIM