News & More from Dr. Tresky AG Switzerland

Have you got the right tool for your die bonding process?

The right choice of pick-up tool leads to the right result. Therefore we at Tresky enjoy to support you with our 40-years tooling experience...

Tresky + MPS = Strong Partnerschip

MPS displays Tresky Die Bonder at Semicon China. Thank you for your effort!

TO bonding made easy !

Seeing increased demands on the market Dr. Tresky developed the second generation of the Dynamic TO-Heating Unit. See its excellent qualities and the new productvideo.

Anniversary offer | Die Bonder T-4909-AE

40 years in the market. This leaves behind amazement and grateful hearts. To say thanks to all customers we offer the new Diebonder T-4909-AE for a special anniversary price. Scroll down to see its unique qualities and perfected functionality in action!

Season's Greetings

Merry Christmas & a Happy New Year

PCIM Europe

Join us at PCIM, the leading trade fair for power electronics, intelligent motion, renewable energy, and energy management. Get firsthand insights into how our die bonding technology is shaping the future of semiconductor manufacturing. Connect with our team, explore our products and solutions, and benefit from expert guidance.

Christmas Gift

Our Christmas present to ourselves. Another CNC machining center to increase production capacity and meet the high demand for our die bonders.

Semicon

Dr. Tresky AG AG looks back on an extremely successful participation at the renowned Semicon in Shanghai.

BRAND NEW!

Brand New Motorized Flip Chip Camera

OUR NEW T-5500 HIGH FORCE DIE BONDER

We're thrilled to announce our new T-5500. The T-5500 is a High Force Die Bonder with a bond force up to 1000N with Tresky’s True Vertical Technology™! This state-of-the-art machine is designed to meet the most demanding requirements of our industry.