DR. TRESKY AG - Die Bonder / Micro Assembly Solutions
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Flip-Chip Applications

General

Flip Chip Microelectronics Assembly describes the technique of mounting a flip-chip upside down (flip), i.e. face-down on a substrate, a printed circuit board or other carrier. The conductive chip bumps are precisely aligned with respect to the bump pad (chip bond pad) and then electrically connected in a eutectic process. In contrast to wire bonding, a technique used to electrically connect chips on the upper side (face-up) with a wire connection, a Flip-Chip Die Bonder from Dr. Tresky works with a beam splitting camera (Flip-Chip Ultra or Flip Chip Ultra MPA) to guarantee the highly precise alignment of the chip with respect to the substrate. Due to the high resolution, the multi-point alignment of the camera and the True Vertical Technology™ an accuracy of +-5µm (or better) is achieved, independent of the respective bond height.

Required technical data for Flip Chip applications:

  • Accuracy: +-5µm (or better)
  • Bond parameters: 20g - 100g bond force per bump depending on application
  • Temperature: 120°C - 400°C depending on application

Various Processes

Process - C4 Soldering
In the C4 process (Controlled Collapse Chip Connection), the chip bumps are soldered onto the package substrate for electrical connection.

Process - Eutectic
Eutectic soldering process for Au/ Sn bumped dies, especially suitable for optoelectronic and RF devices.

Process - Adhesive Technology

In bonding processes, conductive and non-conductive adhesives (ACA, ICA, NCA) are applied to a substrate with a dosing device or by means of a stamp. The chip is aligned with a beam splitter camera, placed in the adhesive and then cured.

Process - Underfill
This process is used for bottom side encapsulated Flip-Chips to compensate for temperature differences and to increase the strength of the connection. In most cases an epoxy based material is used.

Process - Ultrasonic
During placement, the energy required for the welding process comes in the form of mechanical vibrations.

Any questions or interest in a online product demonstration?

Fabio Cocca - your sales contact at Dr. Tresky AG would be happy to talk to you personally. Give him a call or simply use our enquiry form.

+41 44 772 19 41

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