DR. TRESKY AG - Die Bonder / Micro Assembly Solutions
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Competence in micro assembly solutions

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BREAKING NEWS

HIGH FORCE DIE-BONDER UP TO 1000N

Tresky has announced the latest addition to its DIE-bonding machine lineup: the T-5500. This new high-force machine enhances the existing range of T-5100 and T-5300 models with groundbreaking capabilities, set to revolutionize precision bonding applications.

The T-5500 features a sophisticated High Force (HF) module, capable of delivering up to 1000N of bonding force. This remarkable force, combined with Tresky's True Vertical Technology, ensures coplanarity between chip and substrate at any height and force during the bonding process. This level of precision is crucial for high-stakes applications like Thermocompression Bonding, Sinter-Bonding, and Flip-Chip.

T-4909-AE

The T-4909-AE is Tresky's 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated embedded PC. Like all Tresky Die Bonder this pick & place system operates with True Vertical Technology™. The increased travel range, now 95mm on Z, allows working on various bonding heights for Epoxy-, Eutectic- and Flip-Chip processes.

Click here to see more and download the datasheet

Online Product Demonstration

We would be happy to give you the opportunity to get to know our Tresky chip bonding solutions at a virtual machine demonstration in our brand new showroom. We are equipped and ready for you. To make an appointment, please contact:

Tel. +41 44 772 19 41
tresky_at_tresky.com

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Trade shows 2024

Show

Date

Location

Hall / Booth

NEPCON 24 - 26 January Japan | Tokyo Tokyo Big Sight, Hall 3, Booth E32-1A | Technoalpha
THERMAL24 IMAPS 31 January - 01 February France | La Rochelle Mercure Oceanide | Accelonics France
SEMICON Korea

31 January - 02 February

Korea | Seoul COEX, Booth C128 | 3H Corporation Ltd.
APEC 26 -28 February USA | Long Beach | CA Long Beach Convention Center | Tresky Corp.
SEMICON China 20 - 22 March China | Shanghai Shanghai New International Expo Centre | MPS
Fast - Engineering Solutions Live 21 March UK | Gaydon British Motor Museum | Inseto
MicroTech24 IMAPS 10 April UK | Bristol Aerospace Bristol, Patchway | Inseto
Battery Tech Expo 25 April UK | Silverstone The Wing, Silverstone Circuit, Booth B19 | Inseto
IMAPS New England 07 May

USA | Massachusetts | MA

Boxboro Regency Hotel & Conference Center | Booth 413

Advanced Packaging For Power Electronics

08-09 May USA | Massachusetts | MA Crown Plaza Boston-Woburn | Tresky Corp.
PCIM 11 - 13 June

Germany | Nuremberg

NuernbergerMesse Hall5 / Booth 326 | Dr. Tresky AG
NordPac IMAPS 11 - 13 June Finland | Tempere Scandic Rosendahl | Inseto
JPCA 12 - 14 June Japan | Tokyo Tokyo Big Sight, | Technoalpha
MiNaPad IMAPS 19 - 20 June France | Grenoble Convention Centre Grenoble | Accelonics France
NEPCON 19 - 22 June Thailand | Bangkok BITEC, Bangkok | Isodynamique
UK Semiconductors 2024 08 - 09 July UK | Sheffield Sheffield Hallam University | Inseto
CPE2024 08 - 09 July UK | Newcastele

Civic Centre, Barras Bridge, Newcastle | Inseto

EMAX 24 - 26 July Malaysia | Penang SPICE Penang International Sports Arena, Penang | Isodynamique

SEMICON Taiwan

04 - 06 September Taiwan | Taipei TaiNEX Hall 1 / Booth M1058 | Bondtronics
SEMICON India 11 - 13 September India | Dehli

IEML, Greater Noida Hall 8 / Booth H8F19 | GMS

IMAPS

01 - 02 October USA | Boston | MA Encore Boston Harbor Resort | Tresky Corp.

We are happy to meet you!