BREAKING NEWS
HIGH FORCE DIE-BONDER UP TO 1000N
Tresky has announced the latest addition to its DIE-bonding machine lineup: the T-5500. This new high-force machine enhances the existing range of T-5100 and T-5300 models with groundbreaking capabilities, set to revolutionize precision bonding applications.
The T-5500 features a sophisticated High Force (HF) module, capable of delivering up to 1000N of bonding force. This remarkable force, combined with Tresky's True Vertical Technology, ensures coplanarity between chip and substrate at any height and force during the bonding process. This level of precision is crucial for high-stakes applications like Thermocompression Bonding, Sinter-Bonding, and Flip-Chip.
T-4909-AE
The T-4909-AE is Tresky's 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated embedded PC. Like all Tresky Die Bonder this pick & place system operates with True Vertical Technology™. The increased travel range, now 95mm on Z, allows working on various bonding heights for Epoxy-, Eutectic- and Flip-Chip processes.
Online Product Demonstration
We would be happy to give you the opportunity to get to know our Tresky chip bonding solutions at a virtual machine demonstration in our brand new showroom. We are equipped and ready for you. To make an appointment, please contact:
Tel. +41 44 772 19 41
tresky_at_tresky.com
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Trade Shows 2025
Show |
Date |
Location |
Hall / Booth |
|
| NEPCON | 22 - 24 January | Japan | Tokyo | Tokyo Big Sight | Technoalpha | |
| SEMICON Korea | 19 - 21 February | Korea | Seoul |
COEX | 3H Corporation Ltd. |
|
| ISPEC | 20 - 22 February | Indien | Kuruksherta | NIT, Kuruksherta | GMS | |
| SEMICON China | 26 - 28 March | China | Shanghai | Shanghai New International Expo Centre | MPS | |
| JPCA | 4 - 6 June | Japan | Tokyo | Tokyo Big Sight | Technoalpha | |
| SEMICON Taiwan | 10 - 12 September | Taiwan | Taipei | TaiNEX | Bondtronics | |
| IMAPS |
29 September |
USA | San Diego |
Symposium, Town & Country Resort | Tresky Corp. |