BREAKING NEWS
Motorized XY-Stage for Automated Dispense!
We’re excited to introduce motorized functions for our manual die-bonder stage. These features enable automated dispense patterns and additional functionality on our T-5300 and T-5500 systems.
With high-precision motion control and seamless integration into your dispensing workflow, Automatic XY-Stage ensures repeatability, reliability, and speed – all in one compact solution. Whether you're dispensing adhesives or any material in syringe, this new feature gives you the accuracy and flexibility you need.
T-5500
Tresky has announced the latest addition to its DIE-bonding machine lineup: the T-5500. This new high-force machine enhances the existing range of T-5100 and T-5300 models with groundbreaking capabilities, set to revolutionize precision bonding applications.
The T-5500 features a sophisticated High Force (HF) module, capable of delivering up to 1000N of bonding force. This remarkable force, combined with Tresky's True Vertical Technology, ensures coplanarity between chip and substrate at any height and force during the bonding process. This level of precision is crucial for high-stakes applications like Thermocompression Bonding, Sinter-Bonding, and Flip-Chip.
Online Product Demonstration
We would be happy to give you the opportunity to get to know our Tresky chip bonding solutions at a virtual machine demonstration in our brand new showroom. We are equipped and ready for you. To make an appointment, please contact:
Tel. +41 44 772 19 41
tresky_at_tresky.com
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