Tresky AG specializes in precise manual and semi-automatic die bonder systems for research, development, and small-scale production—Swiss engineering for the highest standards.
For 40 years, Dr. Tresky AG has been perfecting the development of handling and pick & place systems, known as die bonders. With our four decades of experience, a professional team, and modular manual and semi-automatic die bonder systems, we are sure to find the right solution for your micro-assembly process.
For over 40 years, Dr. Tresky AG has offered a modern working environment in the high-tech industry. Our motivated team combines experience with creativity, personal responsibility, and agile action.
As a leading manufacturer of precision machines for the semiconductor industry, we value openness, dialogue, and teamwork. We offer secure, permanent positions and are looking for team players who can work independently and thrive with us in the long term.
The history of Tresky AG begins in 1980 with the founding by Dr. Alex Tresky Senior, a pioneer in die bonding technology. With innovative solutions, Swiss engineering, and the highest precision, the company evolved into a leading provider of manual and semi-automatic die bonder systems. Today, Alex Tresky Junior successfully leads the family business in its second generation, driving the development of precision machines for microelectronics worldwide.
Introduction of the motorized XY table and PRS system
With the optional motorized XY table and the Pattern Recognition System (PRS), Tresky enhances its die bonders with key automation and precision features—delivering even greater repeatability and process reliability.
Launch of the T-5500
With the T-5500, Tresky introduces a new generation of high-force die bonders—designed for maximum precision, flexibility, and the most demanding applications.
Purchase and Expansion of Office Space
Tresky expands its office and development facilities—an important step for further growth and innovation.
Launch of the 5000 Series, which represents the culmination of the continuous development of the long-standing successful 3000 Series.
The anniversary model T-4909-AE, Anniversary Edition, is introduced to celebrate the 40th anniversary of Dr. Tresky AG.
Introduction and launch of the newly enhanced T-Suite software, featuring extensive capabilities for improved and more intuitive operation.
Dr. Tresky AG launches the semi-automatic die bonder series 3002-PRO.
Dr. Tresky AG focuses on manual and semi-automatic systems. The business with fully automatic machines was sold to Tresky GmbH.
Development of the Beam Splitter Camera Flip Chip Ultra Series 2.
An additional assembly area was leased for the fully automatic machines. Introduction of the High Force module for manual and semi-automatic machines.
Introduction of the T-6000L with linear drives, higher precision, and even greater flexibility. Establishment of the Tresky Competence Center.
Market launch of the automatic die bonder T-8000 with a large working area and 12-inch wafer handling.
Collaboration with Hilpert Electronics in Switzerland. Global sales of the automatic T-6000.
Generational change: Dr. M. Tresky retires from operational business, handing over management to Alex Tresky as Vice President and Board Member, and Thorleif Brandsberg as General Manager / CEO.
Introduction of the semi-automatic system T-3202 with Windows-based control and four motorized axes.
Establishment of Tresky Corporation in the USA and a development office in Prague, Czech Republic.
Expansion of office and production space.
The first semi-automatic system with motorized XY and Z axes is introduced.
A motorized Z-axis and a new frame concept were developed, forming the foundation for the T-3000 machine series and for handling 8″ and 12″ wafers.
Development of the manual machine T-3001 with wafer handling.
Conversion into a joint-stock company, Dr. Tresky AG.
Development of the T-4907 system and the first rework machine T-4908, both featuring custom-made cast frames.
Following the rapidly growing SMT market, Tresky introduced the models T-4905 and T-4906. These systems were initially equipped with automatic vacuum control and wafer handling. The T-4906 was sold in large quantities.
Relocation to a larger facility and introduction of the first manual SMT placement machine, T-4901.
The first TAB tester, T-5201, is showcased at Semicon in Zurich.
Foundation of Dr. Tresky Engineering.
