Company

Tresky AG specializes in precise manual and semi-automatic die bonder systems for research, development, and small-scale production—Swiss engineering for the highest standards.

About us

For 40 years, Dr. Tresky AG has been perfecting the development of handling and pick & place systems, known as die bonders. With our four decades of experience, a professional team, and modular manual and semi-automatic die bonder systems, we are sure to find the right solution for your micro-assembly process.

Job Openings

“Success is made by people.”

For over 40 years, Dr. Tresky AG has offered a modern working environment in the high-tech industry. Our motivated team combines experience with creativity, personal responsibility, and agile action.

As a leading manufacturer of precision machines for the semiconductor industry, we value openness, dialogue, and teamwork. We offer secure, permanent positions and are looking for team players who can work independently and thrive with us in the long term.

History

The history of Tresky AG begins in 1980 with the founding by Dr. Alex Tresky Senior, a pioneer in die bonding technology. With innovative solutions, Swiss engineering, and the highest precision, the company evolved into a leading provider of manual and semi-automatic die bonder systems. Today, Alex Tresky Junior successfully leads the family business in its second generation, driving the development of precision machines for microelectronics worldwide.

2025

Introduction of the motorized XY table and PRS system
With the optional motorized XY table and the Pattern Recognition System (PRS), Tresky enhances its die bonders with key automation and precision features—delivering even greater repeatability and process reliability.

2024

Launch of the T-5500
With the T-5500, Tresky introduces a new generation of high-force die bonders—designed for maximum precision, flexibility, and the most demanding applications.

2023

Purchase and Expansion of Office Space
Tresky expands its office and development facilities—an important step for further growth and innovation.

2021

Launch of the 5000 Series, which represents the culmination of the continuous development of the long-standing successful 3000 Series.

2020

The anniversary model T-4909-AE, Anniversary Edition, is introduced to celebrate the 40th anniversary of Dr. Tresky AG.

2019

Introduction and launch of the newly enhanced T-Suite software, featuring extensive capabilities for improved and more intuitive operation.

2018

Dr. Tresky AG launches the semi-automatic die bonder series 3002-PRO.

2017

Dr. Tresky AG focuses on manual and semi-automatic systems. The business with fully automatic machines was sold to Tresky GmbH.

Development of the Beam Splitter Camera Flip Chip Ultra Series 2.

2014

An additional assembly area was leased for the fully automatic machines. Introduction of the High Force module for manual and semi-automatic machines.

2013

Introduction of the T-6000L with linear drives, higher precision, and even greater flexibility. Establishment of the Tresky Competence Center.

2012

Market launch of the automatic die bonder T-8000 with a large working area and 12-inch wafer handling.

2011

Collaboration with Hilpert Electronics in Switzerland. Global sales of the automatic T-6000.

2007

Generational change: Dr. M. Tresky retires from operational business, handing over management to Alex Tresky as Vice President and Board Member, and Thorleif Brandsberg as General Manager / CEO.

2005

Introduction of the semi-automatic system T-3202 with Windows-based control and four motorized axes.

2002

Establishment of Tresky Corporation in the USA and a development office in Prague, Czech Republic.

2000

Expansion of office and production space.

1998

The first semi-automatic system with motorized XY and Z axes is introduced.

1996

A motorized Z-axis and a new frame concept were developed, forming the foundation for the T-3000 machine series and for handling 8″ and 12″ wafers.

1994

Development of the manual machine T-3001 with wafer handling.

1990

Conversion into a joint-stock company, Dr. Tresky AG.

1987

Development of the T-4907 system and the first rework machine T-4908, both featuring custom-made cast frames.

1984

Following the rapidly growing SMT market, Tresky introduced the models T-4905 and T-4906. These systems were initially equipped with automatic vacuum control and wafer handling. The T-4906 was sold in large quantities.

1983

Relocation to a larger facility and introduction of the first manual SMT placement machine, T-4901.

1982

The first TAB tester, T-5201, is showcased at Semicon in Zurich.

1980

Foundation of Dr. Tresky Engineering.