Manual High-Force Die Bonder with Semi-Automatic Process Capability
The T-5500 from Tresky expands the product line of the T-5100 and T-5300 with a high-force machine. The sophisticated design of the integrated high-force module, enabling forces up to 100 kg, ensures absolute parallelism between chip and substrate at any height and force during the bonding process – thanks to Tresky’s True Vertical Technology.
The T-5500 expands the successful T-5100 and T-5300 series with a high-force machine. The sophisticated design of the integrated HF module, delivering up to 1000 N, ensures absolute coplanarity between chip and substrate in combination with Tresky True Vertical Technology™ — regardless of height or force during the bonding process. The T-5500 features a motorized, programmable Z-axis and now also a motorized Theta-axis (spindle rotation). With a bonding force of up to 1000 N, the T-5500 excels in applications demanding the highest precision in thermocompression bonding, such as sintering or flip-chip bonding.
XY Movement (Placement Stage):
220mm x 220mm (manual)
Z-Movement:
120 mm (automatic with Z measurement resolution ±0.001 mm)
Spindle rotation:
360° (Unlimited)
Bond Force:
20 g – 100 kg (other force ranges available on request)
Z Measurement Resolution:
±0.001mm
Maximum PCB / Substrate Size:
400mm x 280mm
Placement Accuracy:
±10 µm; <±1 µm optional (process- and option-dependent)
Optical Resolution (Flip-Chip Optics 1× Option):
1.25µm
Optical Resolution (Flip-Chip Optics 2× Option):
0.625µm
Connections:
Compressed air 5–6 bar / Vacuum 0.6 bar (abs)
Dimensions:
900mm x 800mm x 750mm
Weight:
95 kg (+30 kg depending on options)
Voltage:
110V / 220V
