Manual Die Bonder with semi-automatic process capability
Manual Die Bonder with semi-automatic process capability
The T-5300 is the flagship of our die bonder line, expanding the versatile T-5100 series with a motorized, programmable Z-axis featuring True Vertical Technology™. This system excels in repetitive processes for small-series production, where maximum reproducibility and minimal operator influence are required — such as flip-chip or eutectic bonding. For wafer applications, the T-5300-W is also available with an electric die ejector system. An optional beamsplitter enables placement accuracy in the sub-micron range.
Tresky’s T-5300 expands the capabilities of the versatile T-5100 with a motorized, programmable Z-axis. This makes it particularly useful for repetitive processes in small-series production, where operator influence must be minimized. The T-5300 excels in applications demanding the highest precision, such as flip-chip or laser diode placement. The T-5300-W is equipped with Tresky’s electronic die ejector system for wafer pick-up. An optional high-resolution beamsplitter enables placement accuracy in the sub-micron range.
XY Movement (Placement Stage):
220mm x 220mm (manual)
Z-Movement:
120mm (automatic with Z-axis resolution of ±0.001 mm
)
Spindle rotation:
360° (unlimited)
Bond Force:
20g – 4000g (other force ranges available: 10 g – 10000 g)
Maximum PCB / Substrate Size:
400mm x 280mm
Placement Accuracy:
±10µm; <±1µm optional (depends on Prozess and Option)
Optical Resolution (Flip-Chip Optics 1× Option):
1.25µm
Optical Resolution (Flip-Chip Optics 2× Option):
0.625µm
Dimensions (with All-in-One PC):
1155mm x790mm x728mm
Weight:
95kg (+30 kg depending on option)
Voltage:
110V / 220V