PC-Based Manual Die Bonder
The T-5100 is the universal tool for a wide range of micro-assembly tasks. Its manual operation makes it extremely flexible and adaptable for various applications in research and development, and it is equally popular for small-series and pilot production. The T-5100-W is equipped with Tresky’s die ejector system, designed to pick up chips directly from the wafer.
The extremely rigid, newly developed machine base is compact and fits easily on a laboratory bench. A wide variety of modular components are available to cover an extensive range of applications.
Operating a Tresky die bonder/placer is intuitive — just a few minutes of training are enough to get started. The precision and repeatability of part placement are ensured by a series of well-designed solutions and outstanding features such as the “true vertical” linear Z-axis, force control, fine XY adjustment, and high-resolution optics, enabling flip-chip placement with sub-micron accuracy.
XY Movement (Placement Stage):
220mm x 220mm (manual)
Z-Movement:
120mm (manual)
Spindle Rotation:
360° (unlimited)
Max. PCB / Substrate Size:
400mm x 280mm
Bond Force:
20g – 1000g
Placement Accuracy:
±10µm; <±1µm optional (Process- and Option-Dependent)
Optical Resolution (Flip-Chip Optics 1× Option):
1.25µm
Optical Resolution (Flip-Chip Optics 2× Option):
0.625µm
Dimensions (with PC or Monitor):
1155mm x790mm x728mm
Weight:
90kg
Voltage:
110V / 220V
