Manual Die Bonder
The T-4909-AE is Tresky’s 40-year anniversary model. Based on the T-4909, we have developed new software running on an integrated embedded PC. Like all Tresky die bonders, this pick & place system operates with True Vertical Technology™.
The T-4909-AE Anniversary Edition is a manual, cost-effective die bonder with a redesigned ergonomic layout. Like all Tresky products, the T-4909-AE features True Vertical Technology™, ensuring perfect parallelism between the chip and substrate at any bond height. Bonding parameters and sequences can be programmed directly via an integrated embedded PC with touchscreen.
XY Travel (Placement Stage):
180mm x 180mm (manual)
Z-Movement:
95mm (manual)
Spindle Rotation:
360° (Unlimited)
Bond Force:
20g – 1000g
Placement Accuracy:
±10µm (Operator-/process-dependent)
Flip-Chip Placement Accuracy:
±5µm (Option, Operator-/process-dependent)
Connections:
Compressed air 5 – 6 bar / Vacuum 0,6 bar (absolut)
Dimensions:
755mm x 730mm x 500mm
Weight:
33kg
Voltage:
110V / 220V
