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RFID

RFID Bonding – Precise, Reproducible, and Efficient

General

An RFID tag (Radio Frequency Identification) essentially consists of two components: an integrated circuit that stores process information, modulates and demodulates RF signals, and performs other specific functions, and an antenna responsible for transmitting and receiving signals. With Tresky’s die bonder systems, flip chips can be precisely connected to the antenna, or antenna wires can be reliably soldered.

Technical Data

  • Precision: 10µm (or less)
  • Bonding parameters: force 20 g – 400 g and time 2–4 seconds with the curing temperature
  • Temperature profile for chip and antenna up to 200 °C with a ramp rate of up to 18 °C/s (applies to adhesive technologies)

Compatible with

Various Applications / Processes

Our die bonder platforms support a wide range of processes for different applications. Here is an overview of the main methods and their areas of use.

Process – Adhesive Technology (ACP: Anisotropic Conductive Paste)

Apply ACP adhesive to the antenna, precisely align the chip using the beam-splitter camera, place it into the adhesive, and then cure.

Process – Adhesive Technology (NCP: Non-Conductive Paste)

Apply NCP adhesive to the antenna, precisely align the chip using the beam-splitter camera, place it into the adhesive, and cure reliably.

Process – Ultrasonic

During chip placement, ultrasonic energy is selectively applied to the metallic contacts. The resulting friction and heat create a stable and reliable fusion of the components.