Manual systems for precise, flexible applications in research and development – ideal for small-scale production, prototyping, and technological pioneers.
Scalable entry-level model. The T-4909-AE is Tresky’s 40-year anniversary model. Based on the T-4909, we have developed new software running on an integrated embedded PC. Like all Tresky die bonders, this pick & place system operates with True Vertical Technology™. The increased travel range, now 95 mm in Z, allows working at various bond heights for epoxy, eutectic, and flip-chip processes.
PC-based manual die bonder
The T-5100 is a versatile workhorse for a wide range of micro-assembly tasks. Its manual XYZ operation with bond force measurement makes it highly flexible and adaptable for diverse R&D applications, as well as for small- and pilot-scale production.
The T-5100-W version offers the same flexibility as the T-5100, with the added advantage of handling a wafer located beneath the XY worktable using the pneumatic Tresky die ejector system. The system includes all essential features to perform even the most advanced applications in the industry.
