Industries

Tresky provides precise die bonding systems for research and development in high-tech industries such as medical technology, aviation, photonics, semiconductors, and the automotive sector. Our modular solutions adapt flexibly to processes and components.

Medical Technology

In medical technology, precision, reliability, and quality are crucial. Our die bonder platforms handle the smallest, most sensitive components safely—ideal for implantable sensors and microelectronics.

Applications:
Our platforms place sensor chips and microelectronic components with high accuracy, enabling reliable bonding processes for diagnostic devices.

Challenges:
The highest precision, biocompatibility, and process reliability are required. Sensitive components must be handled gently, while strict regulatory standards must be met.

Aerospace

In aerospace, robustness, reliability, and durability are essential. Our die bonders ensure precise placement even under the most demanding conditions—ideal for satellites, avionics systems, and high-frequency components.

Applications:
Our systems enable accurate placement and bonding of power electronics, sensors, and RF components used in space systems, navigation devices, and communication satellites.

Challenges:
The industry requires the highest precision, absolute reliability, and extreme resilience. Electronic assemblies must withstand strong vibrations, temperature fluctuations, and the stresses of space—without compromising process reliability.

Automotive / Transportation

In the automotive and transportation industry, precision, reliability, and cost-efficiency are equally important. Our die bonder platforms enable the safe handling of electronic components essential for modern vehicle systems—from driver assistance and e-mobility to connected applications.

Applications:
Our systems accurately and reliably place power semiconductors, sensors, and microelectronics. They support bonding processes for control units, battery management systems, driver assistance modules, and communication components.

Challenges:
The industry demands maximum robustness, long-term reliability, and reproducible precision. Electronic components must withstand extreme temperature variations, mechanical stress, and long product lifecycles—while maintaining high throughput and strict quality standards.

Photonics / Optoelectronics

In photonics and optoelectronics, the highest precision and exact alignment are crucial. Our die bonder platforms enable the reliable handling of sensitive optical components—ideal for applications in laser technology, sensors, and data communication.

Applications:
Our systems place laser chips, photodiodes, and other optoelectronic components with utmost accuracy, enabling efficient bonding processes for high-speed data transmission, optical sensors, and precision measurement systems.

Challenges:
Sub-micron accuracy, absolute process stability, and gentle handling of delicate components are required. This ensures minimal optical losses and long-term performance of complex systems.

Semiconductor Industry

The semiconductor industry is at the heart of modern technology. Here, precision, efficiency, and innovation determine success. Our die bonder platforms meet the highest demands of this key sector—from research and development to small-scale production.

Applications:
Our systems enable precise placement and bonding of logic and memory chips, power semiconductors, as well as MEMS and sensor structures. Thanks to flexible configurability, they cover a wide range of applications—from prototyping and advanced packaging to complex bonding processes such as flip-chip, thermo-compression, or sinter bonding.

Challenges:
Sub-micron accuracy, absolute process stability, and maximum reproducibility are required. At the same time, solutions must be flexible enough to keep up with new materials, 3D architectures, and innovative interconnection technologies. Our platforms provide the technological foundation to reliably meet the growing demands of the semiconductor industry.