Semi-automatic die bonders combine precise bonding with efficient automation – ideal for research, development, and small-scale production.
The T-5300 and T-5500 are the flagship models of our die bonder series – designed for maximum precision, process stability, and efficiency. Both models feature a motorized, programmable Z-axis and can optionally be equipped with a motorized XY table, pattern recognition system (PRS), and traceability functions.
This combination of cutting-edge technology and Swiss engineering makes the T-5300 and T-5500 the preferred systems for demanding applications in research & development, and small-scale production.
Tresky’s T-5300 is the flagship of our die bonder lineup, expanding the versatility of the T-5100 with a key feature: a motorized, programmable Z-axis combined with our True Vertical Technology™. This combination provides significant advantages, especially for repetitive processes in small-scale production, where maximum reproducibility is required alongside efficiency and process reliability.
The T-5300-W version offers the same flexibility as the T-5300, with the added advantage of handling a wafer located beneath the main table using Tresky’s electric and programmable die ejector system. The system includes all essential features to perform even the most advanced applications in the industry, and a wide range of optional features can be added. Like all Tresky products, the T-5300-W incorporates True Vertical Technology™, ensuring perfect parallelism between the chip and substrate at any bond height.
Tresky’s T-5500 expands the T-5100 and T-5300 product line with a high-force machine. The sophisticated design of the integrated HF module, capable of forces up to 100 kg, ensures perfect parallelism between chip and substrate at any height and force during the bonding process, in combination with Tresky’s True Vertical Technology™.
