Flip-Chip Bonding with Highest Precision – Exact Alignment and Reliable Connections
In flip-chip bonding, the chip is mounted face-down on the substrate, and the conductive bumps are precisely connected to the pads. Tresky flip-chip bonders use beamsplitter cameras with multi-point alignment and True Vertical Technology™ to achieve an accuracy of ±5 µm or better, regardless of the bond height.
Our die bonder platforms support a wide range of processes for different applications. Here is an overview of the main methods and their areas of use.
In the C4 soldering process (Controlled Collapse Chip Connection), the chip bumps are soldered onto a substrate to establish the electrical connection.
Eutectic soldering processes for chips with Au/Sn bumps are specifically used for optoelectronic components and RF antennas.
In adhesive bonding processes, conductive and non-conductive adhesives (ACA, ICA, NCA) are applied to a substrate using a dispenser or stamp. The chip is aligned with a beam-splitter camera, placed into the adhesive, and then cured.
This process is used for flip chips to compensate for temperature differences and to increase bond strength. Typically, an epoxy-based material is used.
In this process, a wave-like energy is transmitted through the pick-up tool to the chip, generating vibrations. The resulting heat causes a solid fusion between the chip and the substrate.
Tresky’s Flip-Chip Camera Module features a beamsplitter optic that allows simultaneous viewing of two objects by optically overlaying the images and displaying them on the screen. The flip-chip optic includes a built-in Ultra HD camera with digital zoom and integrated LED lighting for optimal illumination of the components and substrates to be placed. With high image magnification and fine adjustment on the XY worktable, an accuracy of ±1 µm is achieved.
