Copper Pillar Bonding – Maximum Precision for Modern Interconnection Technologies
Connecting Components with Copper Pillar Bumps
The increasing I/O density of modern ICs pushes traditional flip-chip technologies with solder bumps to their technical limits due to the spherical geometry of the bumps. Copper pillars provide the solution. In this innovative interconnection technology, cylindrical copper pillars with a solder cap are used instead of conventional solder balls.
The result: higher I/O density with tight pitch, improved electrical and thermal performance, increased reliability, and full RoHS compliance.
Our die bonder platforms support a wide range of processes for various applications. Here you’ll find an overview of the main methods and their areas of use.
In extremely compact packages, such as for processors, high-speed memory (DDR III), hearing aids, or RFID solutions.
which combine low resistance with high thermal conductivity.
which require both excellent heat dissipation and maximum operational speed.
where high aspect ratios and stable bump geometries are critical.
