Manual and semi-automatic die bonders for research, development, and small-scale production – Swiss engineering since 1980.
Innovation requires vision – and precise technology. Tresky develops flexible die bonding systems that enable engineers worldwide to turn ideas into products. Swiss-made solutions that make the difference.
years of experience
installed systems worldwide
Precision thanks to True Vertical Technology™
Experience precision, flexibility, and ease of use in one system.
Our T-5000 Series sets new standards in die bonding technology — combining outstanding accuracy with intuitive operation.
Watch our animated product video and discover how the T-5000 Series brings precision engineering to life.
Our manual die bonder platforms offer maximum flexibility and precision for research, development, and prototyping. Ideal when versatile applications and intuitive operation are required.
Our semi-automatic die bonder platforms combine highest precision with efficient automation. Ideal for research, development, and small-scale production, where reproducible results and process reliability are essential.
Discover the diverse applications of our die bonder platforms – from flip-chip and sintering to thermo-compression and UV bonding. Designed for precise and reliable processes in research, development, and production.
We are pleased to offer you the opportunity to discover our Tresky chip bonding solutions during a virtual machine demonstration in our brand-new showroom. We are fully equipped and ready for you. To schedule an appointment, please contact us at:
Stay updated on the latest news from Tresky, technological developments, and upcoming trade shows. Find out where you can meet us in person.
