Hybrid bonding is a reliable, permanent connection that merges a dielectric bond (SiOx) with embedded metal (Cu), creating high-performance interconnections. Known in the industry as
We’re thrilled to announce our new T-5500. 7. June 2024 The T-5500 is a High Force Die Bonder with a bond force up to 1000N
NEW!Motorized Flip Chip CameraCheck out our new Dr. Tresky AG feature for a much faster&easier Thermocompression Bonding for FlipChip
February, 02 2021 40 years in the market! This leaves behind amazement and grateful hearts. To say thanks to all customers we offer the new
